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74LV367PW,112

Part No 74LV367PW,112
Manufacturer NXP / Nexperia
Catalog Logic - Buffers, Drivers, Receivers, Transceivers
Description IC BUFF DVR TRI-ST HEX 16TSSOP
Datasheet
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits
Manufacturer NXP
Packaging Tube/Rail
Status Obsolete(EOL)
Logic Type Buffer, Non-Inverting
Number of Elements 2
Number of Bits per Element 2, 4 (Hex)
Output Type Push-Pull
Current - Output High, Low 8mA, 8mA
Supply Voltage - Operating 1 V to 3.6 V
Temperature Range - Operating -40°C to 125°C (TA)
Mounting SMD (SMT)
Case / Package 16-TSSOP
Win Source Part Number 117764-74LV367PW,112
Popularity Medium
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian 74LV367PW,112 CAD Model

Description

Overview of Product 74LV367PW,112

The 74LV367PW,112 is a high-performance integrated circuit produced by NXP Semiconductors, a leading global semiconductor manufacturer. This particular chip is part of the 74LV family, which is known for its low-voltage operation and high-speed performance. The 74LV367PW,112 is a hex buffer and line driver designed to ensure that signals are cleanly and accurately transmitted, even in environments with significant electrical noise.

Key Features

  • Logic Type: Hex Buffer/Line Driver
  • Number of Channels: 6 Channels
  • Output Type: 3-State
  • Supply Voltage: 2 V to 5.5 V
  • Operating Temperature: -40°C to +125°C
  • Package: TSSOP-16

Performance and Quality

The 74LV367PW,112 is designed for low-voltage operation, making it suitable for battery-operated and portable devices. It operates within a supply voltage range of 2 V to 5.5 V, which allows for flexible integration into various electronic systems. Its hex buffer and line driver configuration enable it to drive lines with high capacitive loads while maintaining signal integrity.

This IC features six independent buffer/line drivers with 3-state outputs, which can be used as either non-inverting buffers or line drivers. The 3-state outputs allow the device to be used in bus-oriented applications, where multiple outputs can share a common connection without interference.

With an extended operating temperature range from -40°C to +125°C, the 74LV367PW,112 is robust and reliable, suitable for industrial and automotive applications that require performance under harsh conditions. The TSSOP-16 (Thin Shrink Small Outline Package) ensures a compact footprint on the PCB, which is critical for space-constrained applications.

Applications

The versatility of the 74LV367PW,112 makes it an excellent choice for a wide range of applications. It is commonly used in:

  • Signal buffering and driving for bus-oriented systems
  • Memory address drivers
  • Portable electronics
  • Data communication systems
  • Industrial control systems
  • Automotive electronics

As a product of NXP Semiconductors, the 74LV367PW,112 is backed by the company's reputation for quality and performance, ensuring that it meets the needs of the most demanding electronic designs.

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