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COP8782CJ

Part No COP8782CJ
Manufacturer National Semiconductor (TI)
Catalog Embedded - Microcontrollers
Description IC MCU 8BIT 4KB OTP 28CDIP
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - Microcontrollers
Mfr National Semiconductor (TI)
Series COP8™ 87xx
Package Bulk
Product Status Active
Programmable Not Verified
Core Processor COP8
Core Size 8-Bit
Connectivity Microwire/Plus (SPI)
Peripherals PWM
Number of I/O 16
Program Memory Size 4KB (4K x 8)
Program Memory Type OTP
RAM Size 128 x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 6V
Oscillator Type External
Temperature Range - Operating -40°C ~ 85°C
Mounting Type Through Hole
Package / Case 28-CDIP (0.600", 15.24mm) Window
Supplier Device Package 28-CDIP
Base Product Number COP8782
Standard Package 20 pcs
MSL Level 3 (168 Hours)
REACH Status Vendor Undefined
ECCN EAR99
HTSUS 8542.31.0001
Win Source Part Number 580008-COP8782CJ
Ultra Librarian 3D Model Ultra Librarian COP8782CJ CAD Model

Description

The COP8782CJ is an 8-bit microcontroller integrated circuit designed for embedded applications.

  • GPTDescription: It belongs to the Integrated Circuits (ICs) - Embedded - Microcontrollers category.
  • GPTDescription: The COP8782CJ is part of the COP8™ 87xx series and features a COP8 core processor.
  • GPTDescription: It has a program memory size of 4KB (4K x 8) and a RAM size of 128 x 8.
  • GPTDescription: The microcontroller supports connectivity via the Microwire/Plus (SPI) interface and includes PWM peripherals.
  • GPTDescription: It operates @ a temperature range of -40°C to 85°C, making it suitable for various environments.
  • GPTDescription: The COP8782CJ is available in a through-hole package type of 28-CDIP (0.600", 15.24mm) with a window.
  • GPTDescription: It is manufactured by National Semiconductor (TI) and is currently an active product in the market.
  • GPTDescription: With its powerful features and reliable performance, the COP8782CJ is an excellent choice for embedded system development.

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