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NT5DS32M16DS-6KI

Part No NT5DS32M16DS-6KI
Manufacturer NANYA
Catalog DDR
Description DDR-333 32Mx16
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 944011-NT5DS32M16DS-6KI
Series *
Ultra Librarian 3D Model Ultra Librarian NT5DS32M16DS-6KI CAD Model

Description

The NT5DS32M16DS-6KI is a 512Mb DDR SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) chip manufactured by NANYA. It's designed for high-speed data transfer and is typically used in applications requiring significant memory bandwidth. This particular module is organized as 32M x 16, indicating it has 32 million rows, 16 columns and leverages a DDR interface.

Applications

  • Graphics cards
  • Networking equipment
  • High-performance computing systems
  • Consumer electronics (e.g., set-top boxes, media players)
  • Embedded systems requiring high memory bandwidth

Features

  • Double data rate architecture: Transfers data on both rising and falling edges of the clock signal, effectively doubling the bandwidth compared to single data rate SDRAM.
  • Data Masking: Ability to selectively mask data during write operations
  • Clock enable (CKE) Power Down Mode
  • Differential clock inputs (CK and /CK)
  • Burst Length: 2, 4, 8
  • CAS Latency (CL): 2, 2.5, 3
  • Precharge: Supports precharge all and precharge active bank
  • Power Supply: 2.5V

Benefits

  • High Bandwidth: DDR technology enables faster data transfer rates, improving system performance.
  • Increased System Responsiveness: Faster memory access reduces latency, leading to a more responsive user experience.
  • Improved Graphics Performance: Ideal for graphics cards and other applications requiring high memory bandwidth for rendering and processing.
  • Efficient Power Management: Low voltage operation reduces power consumption.

Additional Details

The NT5DS32M16DS-6KI operates at a clock frequency up to 166 MHz (333 MHz DDR). It supports burst lengths of 2, 4, and 8. The CAS latency (CL) is configurable, typically supporting values of 2, 2.5, or 3. The chip is packaged in a standard FBGA (Fine-pitch Ball Grid Array) package for easy integration into various systems. The operating temperature ranges from 0°C to 70°C.

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