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LFD211G57MEFE897

Part No LFD211G57MEFE897
Manufacturer Murata Electronics North America
Catalog OEM Parts (J - L)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 998798-LFD211G57MEFE897
Categories OEM Parts(J-L)
Manufacturer Murata Electronics North America
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian LFD211G57MEFE897 CAD Model

Description

The LFD211G57MEFE897 is a multilayer ceramic inductor from Murata Electronics. These inductors are designed for high-frequency applications and are characterized by their small size and excellent electrical characteristics.

Applications:

  • RF circuits
  • Mobile communication devices
  • Wireless LAN (WLAN) devices
  • Bluetooth modules
  • Matching circuits
  • High-frequency filters

Features:

  • Small size (2012 size: 2.0 x 1.2 mm)
  • High Q factor
  • Excellent self-resonant frequency (SRF)
  • Tight inductance tolerance
  • High reliability
  • Lead-free construction

Benefits:

  • Miniaturization: The small size allows for compact circuit designs, which is crucial in modern portable devices.
  • Improved circuit performance: High Q factor minimizes losses, leading to improved signal quality and efficiency in RF circuits.
  • Stable performance: Tight inductance tolerance ensures consistent performance across different devices and operating conditions.
  • Reduced electromagnetic interference (EMI): The inductor's design minimizes unwanted radiation, contributing to improved EMI performance.
  • Environmentally friendly: Lead-free construction complies with environmental regulations.

Technical Specifications:

The LFD211G57MEFE897 has an inductance value of 0.056µH (56nH) with a tolerance of ±20%. Its self-resonant frequency is typically around 1.6 GHz. The operating temperature range is -55°C to +125°C. These inductors are manufactured using a multilayer ceramic process, which ensures high reliability and consistent performance. They are typically surface mount devices (SMD) and are suitable for automated assembly processes.

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