The 53307-2071 is a SlimStack™ Board-to-Board Connector manufactured by Molex, LLC. This connector is designed for parallel board stacking applications, providing a low-profile, high-density interconnect solution. It's suitable for applications where space is limited and reliable connections are critical.

Applications

• Smartphones and mobile devices
• Tablets and laptops
• Wearable electronics
• Digital cameras
• Medical devices

Features

• Low profile design
• High density contact arrangement
• Robust construction
• Secure locking mechanism
• Surface mount termination

Benefits

• Maximizes space utilization in compact electronic devices.
• Provides a large number of signal connections in a small footprint.
• Withstands mechanical stress and vibration.
• Ensures a reliable and stable connection.
• Facilitates automated assembly processes.

Technical Specifications

The 53307-2071 features a 0.40mm pitch and 20 circuits. It typically has a height of around 0.70mm. The housing material is usually a high-temperature thermoplastic, and the contacts are typically made of copper alloy with gold plating. Refer to the Molex datasheet for current rating, voltage rating and operating temperature range.

Note: Always refer to the manufacturer's datasheet for precise specifications, including mating connector part numbers, current ratings, voltage ratings, and application guidelines to ensure optimal performance and reliability in your specific application.