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52207-1590

Part No 52207-1590
Manufacturer Molex, LLC
Catalog Hard To Find
Description 1.0mm Pitch FPC Conn ZIF SMT
Sample
Rohs State Need to verify
ECAD Module
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RoHS State Request Verification
Manufacturer Molex, LLC
Win Source Part Number 1129082-52207-1590
Manufacturer Homepage www.molex.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian 52207-1590 CAD Model

Description

The 52207-1590 is a SlimStack™ Board-to-Board Connector manufactured by Molex, LLC. It is designed to provide a reliable and space-saving connection between two printed circuit boards (PCBs) in a parallel (mezzanine) configuration. This connector is part of the SlimStack series, known for its low profile and high density, making it ideal for compact electronic devices.

Applications

  • Mobile Phones
  • Smartphones
  • Tablet Computers
  • Laptop Computers
  • Digital Cameras
  • Wearable Devices
  • Other Compact Electronic Devices

Features

  • Low Profile Design: Minimizes the overall height of the connection between boards.
  • High Density: Allows for a large number of signals to be transmitted in a small area.
  • Surface Mount Technology (SMT): Designed for automated assembly processes.
  • Secure Mating: Provides a robust and reliable connection.
  • Durable Construction: Ensures long-term performance and reliability.
  • Halogen-Free: Complies with environmental standards.

Benefits

  • Saves Space: Enables the design of smaller and more compact electronic devices.
  • Increases Signal Density: Allows for more functionality in a limited space.
  • Automated Assembly: Reduces manufacturing costs and improves efficiency.
  • Reliable Connection: Ensures stable and consistent performance.
  • Long-Term Durability: Minimizes the need for repairs or replacements.
  • Environmentally Friendly: Reduces the environmental impact of the product.

Specifications

The 52207-1590 has a pitch (contact spacing) typically around 0.4mm or 0.5mm, offering a very fine pitch for high-density connections. The number of circuits (contacts) is 90. It's designed for parallel board stacking with a specific stacking height (the distance between the two boards). The voltage rating and current rating are specified in the product datasheet, typically suitable for low-power applications. The connector material is often high-temperature thermoplastic, allowing for reflow soldering processes. Contact plating is typically gold or tin, ensuring good electrical conductivity and corrosion resistance. Detailed mechanical dimensions, electrical characteristics, and environmental compliance information can be found in the Molex datasheet.

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