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TUF-1MH+

Part No TUF-1MH+
Manufacturer Mini-Circuits
Catalog Misc Products
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Rohs State rohs
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Manufacturer Mini-Circuits
Popularity Medium
Supply and Demand Status Balance
Win Source Part Number 841165-TUF-1MH+
Ultra Librarian 3D Model Ultra Librarian TUF-1MH+ CAD Model

Description

The TUF-1MH+ is a Mini-Circuits frequency mixer designed for up-conversion and down-conversion applications in a wide range of communication systems.

Applications:

  • Satellite communication: Used in satellite transceivers for frequency translation.
  • Wireless communication: Employed in cellular base stations and mobile devices.
  • Radar systems: Utilized in radar receivers and transmitters.
  • Test equipment: Used in signal generators and spectrum analyzers.
  • Software-defined radios (SDR): Provides frequency mixing for SDR architectures.

Features:

  • Wide bandwidth: Operates over a broad frequency range, typically from 2 to 600 MHz.
  • Low conversion loss: Minimizes signal attenuation during frequency conversion.
  • High isolation: Provides excellent isolation between ports to prevent unwanted signal leakage.
  • Surface mount package: Enables automated assembly processes.
  • Rugged construction: Withstands harsh environmental conditions.

Benefits:

  • Improved system performance: Low conversion loss and high isolation enhance overall signal quality.
  • Simplified circuit design: Reduces the need for external filtering and amplification.
  • Compact design: Small size allows for integration in dense circuit layouts.
  • Versatile applications: Suitable for various frequency mixing requirements.
  • Reliable operation: Provides consistent performance over temperature variations.

The TUF-1MH+ features a low profile and is designed for a 50-ohm impedance system. Specific technical characteristics include a conversion loss of typically 6.5 dB, an LO-to-RF isolation of 35 dB, and an LO-to-IF isolation of 30 dB. It has excellent linearity and is capable of handling high input power levels. The mixer is housed in a rugged surface-mount package that provides excellent thermal performance. This device's high performance and small size make it suitable for demanding applications where signal integrity and board space are critical.

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