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Same model may have multiple batches, images only for reference.
APA300-FGG144I Real Image
Same model may have multiple batches, images only for reference.

APA300-FGG144I

Part No APA300-FGG144I
Manufacturer Microsemi Corporation
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 100 I/O 144FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Manufacturer Microsemi Corporation
Packaging Tray
Total RAM Bits 73728
Number of I/O 100
Number of Gates 300000
Supply Voltage (V) 2.3V ~ 2.7V
Mounting Style SMD
Temperature Range - Operating -40°C ~ 85°C
Manufacturer Package 144-LBGA
Supplier Device Package 144-FPBGA (13x13)
Part Number Series APA300
Manufacturer Pack Quantity 160
MSL Level 3 (168 Hours)
Popularity Low
Supply and Demand Status Limited
Win Source Part Number 812543-APA300-FGG144I
Ultra Librarian 3D Model Ultra Librarian APA300-FGG144I CAD Model

Description

The Microsemi APA300-FGG144I is a high-performance System on Chip (SoC) device manufactured by Microsemi Corporation.

  • I/Os: 100
  • Gates: 300000
  • RAM Bits: 73728
  • Package: 144-FPBGA (13x13)
  • Supply Voltage: 2.3V to 2.7V
  • Temperature Range: -40°C to 85°C
  • Supply: Tray
  • Manufacturer Pack Quantity: 160
  • MSL Level: 3 (168 hours)

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