The MT47H256M8HG-37EIT:A is a DDR2 SDRAM (Double Data Rate 2 Synchronous Dynamic Random-Access Memory) component manufactured by Micron Technology Inc. This memory module is designed for high-performance applications requiring fast data transfer rates and efficient memory access. It is commonly used in various computing and embedded systems.

Applications

• High-performance desktop computers
• Laptop computers
• Workstations
• Networking equipment
• Embedded systems

Features

• Capacity: 256 Meg x 8 bits
• Data Rate: DDR2 technology, offering significantly improved bandwidth compared to DDR SDRAM.
• Clock Frequency: The -37E speed grade specifies the operating frequency.
• Voltage: Operates at 1.8V, providing a balance between performance and power efficiency.
• Interface: DDR2 interface ensures compatibility with a wide range of chipsets and systems.
• Package: FBGA (Fine-pitch Ball Grid Array) package for optimized board-level assembly and thermal characteristics.

Benefits

• High Bandwidth: DDR2 technology enables faster data transfer rates, enhancing system performance.
• Low Power Consumption: Operates at a lower voltage compared to previous generations, reducing power consumption and heat dissipation.
• Improved Performance: Facilitates faster application loading, smoother multitasking, and enhanced overall system responsiveness.
• Reliability: Manufactured by Micron, a reputable memory manufacturer, ensuring high reliability and stability.
• Compatibility: Designed for compatibility with systems supporting DDR2 memory.

Additional Details

The MT47H256M8HG-37EIT:A adheres to JEDEC standards for DDR2 SDRAM, ensuring interoperability and compliance with industry specifications. It incorporates features such as on-chip termination (ODT) to improve signal integrity and reduce reflections. The memory module also supports power-saving modes to optimize power consumption during idle periods. The -37EIT designation indicates the speed grade and temperature range supported by the memory module. The FBGA package allows for efficient heat dissipation and board mounting in high-density applications. Careful consideration should be given to the system's memory controller and chipset compatibility to ensure optimal performance and stability.