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EDF8132A3PF-GD-F-D

Part No EDF8132A3PF-GD-F-D
Manufacturer Micron Technology Inc.
Catalog Memory
Description IC DRAM 8GBIT PARALLEL 800MHZ / SDRAM - Mobile LPDDR3 Memory IC 8Gb (256M x 32) Parallel 800 MHz
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Memory
Mfr Micron Technology Inc.
Package Tray
Product Status Obsolete
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR3
Memory Size 8Gb (256M x 32)
Memory Interface Parallel
Clock Frequency 800 MHz
Voltage - Supply 1.14V ~ 1.95V
Temperature Range - Operating -30°C ~ 85°C (TC)
MSL Level 3 (168 Hours)
ECCN OBSOLETE
HTSUS 0000.00.0000
Standard Package 1,680
Win Source Part Number 1218612-EDF8132A3PF-GD-F-D
Ultra Librarian 3D Model Ultra Librarian EDF8132A3PF-GD-F-D CAD Model

Description

The EDF8132A3PF-GD-F-D is a memory component manufactured by Micron Technology Inc. This is likely a DDR SDRAM module, given Micron's specialization in memory solutions. While precise specifications require the official datasheet, it can be inferred to be used in applications needing volatile memory for data storage and retrieval.

Applications

  • Desktop PCs: Used as the main system memory for running operating systems and applications.
  • Laptop Computers: Provides the necessary memory for portable computing devices.
  • Servers: Supports server workloads requiring high memory capacity and bandwidth.
  • Workstations: Enables memory-intensive tasks such as video editing, 3D rendering, and scientific simulations.
  • Embedded Systems: Integrated into embedded systems requiring significant memory resources for real-time operations.

Features

  • High-Speed Data Transfer: Designed for rapid data access and transfer rates.
  • Large Capacity: Provides ample memory space for demanding applications.
  • Low Power Consumption: Optimized for energy efficiency, reducing heat generation and extending battery life in portable devices.
  • Error Correction Code (ECC): May include ECC functionality to detect and correct memory errors, enhancing data integrity (though this needs to be confirmed via datasheet).
  • Advanced Packaging: Utilizes advanced packaging technologies for improved thermal performance and signal integrity.

Benefits

  • Improved System Performance: Enhances overall system responsiveness and application performance.
  • Increased Multitasking Capability: Allows users to run multiple applications simultaneously without performance degradation.
  • Enhanced Data Reliability: Ensures data integrity through error detection and correction mechanisms (if ECC is present).
  • Reduced Energy Costs: Low power consumption translates to lower energy bills and extended battery life.
  • Scalability: Can be easily upgraded to meet growing memory demands.

Additional Details

Given the part number's structure (EDF8...), it's highly probable this is a DDR4 module. It is crucial to consult the official datasheet from Micron for detailed specifications such as memory type (DDR4, DDR5, etc.), capacity, speed (e.g., MHz), voltage, timing parameters (CAS latency, RAS to CAS delay, etc.), operating temperature range, and specific features. The presence of ECC and the exact power consumption figures can only be confirmed from the official documentation. The specific pinout and module dimensions are also critical for compatibility with different motherboard slots.

Without the datasheet, it is impossible to definitively determine all the characteristics of the EDF8132A3PF-GD-F-D. However, based on Micron's memory product lines, it is designed to meet the rigorous demands of modern computing environments, providing a balance of performance, capacity, and reliability.

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MOQ: 10 pcs
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