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M2S090T-1FGG676

Part No M2S090T-1FGG676
Manufacturer Microchip Technology
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-M3 166MHZ 676FBGA
Datasheet
Sample
Rohs State rohs
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Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 9 Weeks
Features ARM® Cortex®-M3 System On Chip (SOC) IC series FPGA - 90K Logic Modules 166MHz 676-FBGA (27x27)
Manufacturer Microchip Technology
Series SmartFusion®2
Package Tray
Core Processor ARM® Cortex®-M3
Speed 166MHz
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals DDR, PCIe, SERDES
Number of I/O 425
Operating Temperature Range 0°C ~ 85°C (TJ)
Package 676-BGA
Case / Package 676-FBGA (27x27)
Family Name M2S090
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Quantity per package 40
Popularity Medium
Supply and Demand Status Limited
Win Source Part Number 880616-M2S090T-1FGG676
Ultra Librarian 3D Model Ultra Librarian M2S090T-1FGG676 CAD Model

Description

Microchip Technology M2S090T-1FGG676 Product Overview

The M2S090T-1FGG676 is a high-performance, field-programmable gate array (FPGA) from Microchip Technology's SmartFusion2 SoC FPGA family. This product integrates an abundance of advanced features, making it an ideal choice for a wide range of applications such as industrial control, communication systems, medical equipment, and defense applications.

Key Features:

  • High Density and Performance: The device boasts 90K logic elements (LEs), providing ample space for complex logic designs and high-speed data processing capabilities.
  • System-on-Chip (SoC) Integration: It includes an ARM Cortex-M3 processor, offering a 166 MHz performance for efficient processing and control tasks within a single chip, reducing system complexity and power consumption.
  • Security: Equipped with advanced security features, such as a physically unclonable function (PUF), secure boot, and 256-bit AES encryption, the M2S090T-1FGG676 ensures data and intellectual property protection, making it suitable for sensitive and secure applications.
  • Memory Resources: The device is equipped with ample memory resources, including 512KB of embedded non-volatile memory (eNVM) and 256KB of embedded SRAM, which facilitate efficient data storage and quick access.
  • I/O Capability: With up to 300 user I/Os, this FPGA provides extensive connectivity options, allowing designers to interface with a wide variety of peripherals and other devices.
  • Power Efficiency: SmartFusion2 devices, including the M2S090T-1FGG676, are designed with low power consumption in mind, featuring Flash*Freeze technology that enables power savings while retaining FPGA configuration data.
  • Package: The component is available in a 676-pin Fine Pitch Grid Array (FGG) package, which is suitable for space-constrained applications while offering robust connectivity.

Applications:

The versatility of the M2S090T-1FGG676 extends to various sectors. Its integration capabilities and security features make it a perfect fit for industrial automation, where reliability and data protection are paramount. In communication systems, it supports high-speed signal processing and connectivity. The medical industry benefits from its precision and safety features, while defense applications value its robust security and performance in harsh environments.

Whether you're designing complex embedded systems or looking for a secure and reliable FPGA solution, the M2S090T-1FGG676 from Microchip Technology is engineered to meet a diverse set of requirements, delivering top-notch performance and security in a compact, power-efficient package.

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