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A3PE3000-FG896I

Part No A3PE3000-FG896I
Manufacturer Microchip Technology
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 620 I/O 896FBGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 41 Weeks
Features series Field Programmable Gate Array (FPGA) IC 620 516096 896-BGA
Manufacturer Microchip Technology
Series ProASIC3E
Package Tray
Number of I/O 620
Operating Temperature Range -40°C ~ 100°C (TJ)
Mounting Surface Mount
Package 896-BGA
Case / Package 896-FBGA (31x31)
Family Name A3PE3000
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A7A
HTSUS 8542.39.0001
Quantity per package 27
Popularity High
Supply and Demand Status Balance
Win Source Part Number 908963-A3PE3000-FG896I
Ultra Librarian 3D Model Ultra Librarian A3PE3000-FG896I CAD Model

Description

Microchip Technology's A3PE3000-FG896I Product Overview

The A3PE3000-FG896I is a high-performance FPGA (Field Programmable Gate Array) device from Microchip Technology's ProASIC3 series, designed to meet the needs of a wide range of applications. This versatile component is a perfect solution for designers looking for a programmable logic device that offers a rich set of features and a flexible architecture to tackle complex digital designs.

Key Features of A3PE3000-FG896I

  • High Density: The A3PE3000-FG896I boasts a high logic density, providing up to 3 million system gates to support complex digital systems and integrated functions.
  • Low Power Consumption: Tailored for power-sensitive applications, this device offers low power operation without compromising performance, making it ideal for portable and battery-operated devices.
  • Security: With an emphasis on security, the A3PE3000-FG896I includes features like flash lock to protect proprietary designs and prevent unauthorized access or copying.
  • Speed Grades: Available in multiple speed grades, it allows designers to choose the optimal performance level for their specific application requirements.
  • Package Type: The device comes in a Fine-pitch Grid Array (FG896) package, providing a compact footprint and reliable connectivity for high-density board designs.
  • In-System Programmability: The FPGA supports in-system programmability, enabling designers to update the firmware and make changes to the logic configuration even after deployment, which is crucial for future-proofing products and field upgrades.
  • Live at Power-Up: ProASIC3 devices like the A3PE3000-FG896I feature live at power-up capabilities, which allow for predictable system initialization every time the device is powered on.

Applications

The A3PE3000-FG896I is engineered to support a diverse range of applications, including but not limited to:

  • Industrial control systems
  • Automotive electronics
  • Telecommunications infrastructure
  • Medical devices
  • Aerospace and defense systems

With its robust design, the A3PE3000-FG896I from Microchip Technology is an excellent choice for designers who require a flexible, secure, and high-performance FPGA solution for their next project.

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