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A3P600-FGG256

Part No A3P600-FGG256
Manufacturer Microchip Technology
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 177 I/O 256FBGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 49 Weeks
Features series Field Programmable Gate Array (FPGA) IC 256-LBGA
Manufacturer Microchip Technology
Series ProASIC3
Package Tray
Number of I/O 177
Operating Temperature Range 0°C ~ 85°C (TJ)
Mounting Surface Mount
Package 256-LBGA
Case / Package 256-FPBGA (17x17)
Family Name A3P600
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Other Part Number 1100-1304, A3P600-FGG256-ND
Quantity per package 90
Popularity High
Supply and Demand Status Balance
Win Source Part Number 908953-A3P600-FGG256
Ultra Librarian 3D Model Ultra Librarian A3P600-FGG256 CAD Model

Description

The A3P600-FGG256 is a high-performance FPGA (Field Programmable Gate Array) from Microchip Technology, designed to meet the needs of a wide range of applications. This versatile component is part of the ProASIC3 series, known for its low power consumption and high functionality.

Key Features:

  • High Capacity: The A3P600-FGG256 offers a robust 600K system gates that provide ample space for complex designs and applications.
  • Flash Memory Technology: This device leverages non-volatile flash memory, ensuring data retention without the need for external configuration memory, and enabling instant-on capabilities.
  • Security: With its built-in security features, the A3P600-FGG256 protects your designs against unauthorized access and copying, making it an ideal choice for sensitive applications.
  • Low Power Operation: The FPGA is engineered for low power consumption, which is critical for battery-operated and power-sensitive devices.
  • I/O Versatility: It comes equipped with 256 I/O pins, providing a high degree of flexibility for interfacing with a wide range of peripherals and other components.
  • Speed Grades: Available in multiple speed grades, the A3P600-FGG256 can be optimized for performance or power, depending on the application requirements.
  • Package: The device is offered in a Fine Pitch Grid Array (FGG256) package, which ensures a compact footprint and reliable connection to the PCB.

Applications:

The A3P600-FGG256 is suitable for a diverse array of applications, including but not limited to:

  • Automotive systems
  • Industrial control systems
  • Medical devices
  • Security systems
  • Telecommunications infrastructure
  • Consumer electronics

With its combination of high density, low power, and security features, the A3P600-FGG256 from Microchip Technology is a compelling choice for designers looking to leverage FPGA technology in their next project.

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