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Same model may have multiple batches, images only for reference.
LFXP2-17E-6QN208C Real Image
Same model may have multiple batches, images only for reference.

LFXP2-17E-6QN208C

Part No LFXP2-17E-6QN208C
Manufacturer Lattice Semiconductor Corporation
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 146 I/O 208QFP
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 33 Weeks
Features series Field Programmable Gate Array (FPGA) IC 208-BFQFP
Manufacturer Lattice Semiconductor Corporation
Series XP2
Package Tray
Number of I/O 146
Operating Temperature Range 0°C ~ 85°C (TJ)
Mounting Surface Mount
Package 208-BFQFP
Case / Package 208-PQFP (28x28)
Family Name LFXP2-17
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Other Part Number 220-1119, LFXP217E6QN208C
Quantity per package 24
Popularity High
Supply and Demand Status Balance
Win Source Part Number 923011-LFXP2-17E-6QN208C
Ultra Librarian 3D Model Ultra Librarian LFXP2-17E-6QN208C CAD Model

Description

The Lattice Semiconductor Corporation XP2 is a series of FPGA ICs with 146 I/O.

  • Package: Tray
  • Package: 208-BFQFP
  • Mounting: Surface Mount
  • Operating Temperature Range: 0°C to 85°C (TJ)
  • ECCN: EAR99
  • Supply and Demand Status: Balanced
  • Units per Package: 24
  • MSL Level: 3
  • Estimated Production Lead Time: 33 weeks
  • REACH Status: Unaffected
  • HTSUS Code: 8542.39.0001
  • Other Part Numbers: 220-1119, LFXP217E6QN208C

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