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HC55185SMPL

Part No HC55185SMPL
Manufacturer Intersil
Catalog OEM Parts (F - I)
Sample
Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1061863-HC55185SMPL
Categories OEM Parts(F-I)
Manufacturer Intersil
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian HC55185SMPL CAD Model

Description

The HC55185SMPL is a SLIC (Subscriber Line Interface Circuit) manufactured by Intersil, integral to telecommunications equipment. This device acts as an interface between a telephone line and the switching network. It's responsible for providing essential functions like battery feed, ringing, supervision, and hybrid conversion required for connecting a standard telephone to a communication system.

Applications:

  • Central Office (CO) switches
  • Private Branch Exchange (PBX) systems
  • Voice over IP (VoIP) gateways and adapters
  • Customer Premises Equipment (CPE)
  • Line cards for telecommunication equipment

Features:

  • Battery feed for powering the telephone
  • Ringing generation for incoming call alerts
  • Line supervision for detecting on-hook/off-hook status
  • Hybrid function to separate transmit and receive audio signals
  • Low power consumption for energy efficiency
  • Integrated protection against voltage surges and line faults
  • Compliance with relevant telecommunications standards

Benefits:

  • Enables clear and reliable voice communication
  • Reduces overall system cost
  • Enhances system reliability
  • Simplifies design and implementation of telecommunications interfaces
  • Minimizes power consumption, leading to lower operating expenses
  • Protects the system from damaging voltage spikes and line irregularities

Additional Details:

The HC55185SMPL typically needs external components such as resistors, capacitors, and transformers for complete SLIC operation. Design considerations include adhering to the specified voltage and current ranges detailed in the Intersil datasheet. It is frequently paired with codecs and microcontrollers to form a comprehensive telephone line interface. Packaging usually involves surface-mount technology, which aligns with modern, high-density circuit board assembly practices.

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