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EP4SGX360KF40I3N

Part No EP4SGX360KF40I3N
Manufacturer Intel
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 744 I/O 1517FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Manufacturer Intel
Packaging Tray
Number of LABs/CLBs 14144
Number of Logic Elements/Cells 353600
Total RAM Bits 23105536
Number of I/O 744
Supply Voltage (V) 0.87V ~ 0.93V
Mounting Style SMD
Temperature Range - Operating -40°C ~ 100°C
Manufacturer Package 1517-BBGA, FCBGA
Supplier Device Package 1517-FBGA (40x40)
Part Number Series EP4SGX360
Manufacturer Pack Quantity 21
MSL Level 3 (168 Hours)
Popularity Low
Supply and Demand Status Limited
Win Source Part Number 812940-EP4SGX360KF40I3N
Ultra Librarian 3D Model Ultra Librarian EP4SGX360KF40I3N CAD Model

Description

The EP4SGX360KF40I3N is a high-performance Stratix IV GX FPGA from Intel (formerly Altera). This FPGA is designed for demanding applications requiring significant logic density, memory resources, and high-speed communication interfaces. It is well-suited for complex digital signal processing, high-bandwidth data transmission, and custom computing solutions.

Applications:

  • High-speed networking equipment (e.g., routers, switches)
  • Advanced radar and sonar systems
  • Medical imaging devices
  • High-performance computing clusters
  • Video processing and broadcast equipment

Features:

  • 360,000 equivalent logic elements (LEs)
  • Up to 27.2 Mbits of embedded memory
  • Up to 960 user I/O pins
  • Transceivers supporting data rates up to 11.3 Gbps
  • Hard IP blocks for PCI Express Gen2 and Gigabit Ethernet

Benefits:

  • Offers high performance and flexibility for complex designs
  • Enables integration of multiple functions into a single device
  • Reduces power consumption compared to discrete solutions
  • Accelerates time-to-market with comprehensive development tools
  • Provides a scalable platform for future upgrades

Additional Details:

The EP4SGX360KF40I3N is manufactured using a 40nm process technology and comes in a 1517-pin flip-chip BGA package. It supports various I/O standards like LVDS, HSTL, and SSTL. It includes features like dynamic power management and power gating to optimize power consumption. The device is configured via JTAG, Active Serial, or Passive Serial modes. Intel's Quartus II software provides a complete design environment for development, including synthesis, place and route, and verification tools. The 'I3' in the part number indicates an industrial temperature grade. Refer to the device datasheet for precise electrical characteristics, timing specifications, and thermal management guidelines. Proper cooling solutions may be necessary to maintain the device within its operating temperature range under heavy workloads.

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1+ $544.0223 $544.0223
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Availability: 264 pieces
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