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Same model may have multiple batches, images only for reference.
25EMPPC603E2BB200K
Same model may have multiple batches, images only for reference.

25EMPPC603E2BB200K

Part No 25EMPPC603E2BB200K
Manufacturer IBM
Catalog Embedded - Microprocessors
Description IC MPU 200MHZ 278FCPBGA
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - Microprocessors
Mfr IBM
Package Bulk
Product Status Active
Core Processor PowerPC EM603e
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 200MHz
Graphics Acceleration No
Voltage - I/O 2.5V, 3.3V
Temperature Range - Operating 0°C ~ 105°C (TJ)
Mounting Type Surface Mount
Package / Case 278-BBGA, FCBGA
Supplier Device Package 278-FCPBGA (21x21)
Standard Package 1 pcs
MSL Level 3 (168 Hours)
REACH Status Vendor Undefined
ECCN 3A991A2
HTSUS 8542.31.0001
Win Source Part Number 918079-25EMPPC603E2BB200K
Ultra Librarian 3D Model Ultra Librarian 25EMPPC603E2BB200K CAD Model

Description

The IBM 918079-25EMPPC603E2BB200K is an embedded microprocessor with a core processor of PowerPC EM603e.

  • Core processor: PowerPC EM603e
  • Core: Single core
  • Bus width: 32-bit
  • Speed: 200MHz
  • Category: integrated circuits (ICs) - embedded - microprocessors
  • Co-processors/DSP: No
  • RAM controllers: No
  • Graphics acceleration: No
  • Display & interface controllers: No
  • Ethernet: No
  • SATA: No
  • Voltage supply: 2.5V and 3.3V
  • Package: Bulk package
  • Mounting type: Surface mount
  • Package/case: 278-BBGA, FCBGA
  • Supplier device package: 278-FCPBGA (21x21)
  • Temperature range: 0°C to 105°C
  • Product status: Active
  • Manufacturer: IBM

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