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HY5PS1G1631JFR-S6

Part No HY5PS1G1631JFR-S6
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR2-800 64Mx16
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 942251-HY5PS1G1631JFR-S6
Series *
Ultra Librarian 3D Model Ultra Librarian HY5PS1G1631JFR-S6 CAD Model

Description

The HY5PS1G1631JFR-S6 is a 1Gbit DDR2 SDRAM (Double Data Rate 2 Synchronous Dynamic Random-Access Memory) chip manufactured by Hynix Semiconductor. It is designed for applications needing high-speed and high-capacity memory.

Applications

  • Graphics Cards
  • Gaming Consoles
  • High-Performance Computing
  • Networking Devices
  • Video Processing

Features

  • Capacity: 1Gbit (128MB)
  • Organization: 64M x 16 bits
  • Interface: DDR2 SDRAM
  • Speed Grade: S6 (Indicates a specific clock speed)
  • Operating Voltage: Typically 1.8V
  • Package: FBGA (Fine-Pitch Ball Grid Array)
  • Clock Frequency: Determined by the speed grade (S6)
  • Burst Length: Supports burst lengths of 4 and 8
  • Double Data Rate: Transfers data on both the rising and falling edges of the clock signal, doubling the data transfer rate.
  • On-Die Termination (ODT): Improves signal integrity and reduces reflections.

Benefits

  • High Bandwidth: DDR2 technology offers significantly higher bandwidth compared to DDR SDRAM, improving system performance.
  • Improved System Responsiveness: Faster memory access leads to quicker application loading and smoother multitasking.
  • Reduced Power Consumption: 1.8V operation reduces power consumption and heat generation, making it suitable for power-sensitive applications.
  • Enhanced Signal Integrity: On-Die Termination (ODT) ensures stable operation and reduces signal noise.
  • Large Capacity: 1Gbit capacity allows for handling larger datasets and more complex applications.

Additional Details

The HY5PS1G1631JFR-S6's speed grade (S6) is critical to identifying the precise clock frequency and timings; the datasheet should be consulted for this information. Key timings like CAS Latency (CL), tRCD, tRP, and tRAS need to be correctly configured for optimal memory performance. The FBGA package offers a compact design and enhances thermal dissipation. The device supports auto-refresh and self-refresh for efficient power management. The DDR2 SDRAM technology provides a substantial performance improvement compared to older memory technologies and is well-suited for applications demanding high-speed memory access.

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