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H9TKNNN4GDMRHR-NGMR

Part No H9TKNNN4GDMRHR-NGMR
Manufacturer Hynix Semiconductor
Catalog Electronic Wholesale
Sample
Rohs State rohs
ECAD Module
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Reference Date Code 2012+
Reference case FBGA-216
Manufacturer Hynix Semiconductor
Manufacturer Homepage www.skhynix.com/ko/index.jsp
Win Source Part Number 753425-H9TKNNN4GDMRHR-NGMR
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian H9TKNNN4GDMRHR-NGMR CAD Model

Description

The Hynix Semiconductor H9TKNNN4GDMRHR-NGMR is a high-capacity mobile LPDDR4 SDRAM memory chip. This component is designed for use in smartphones, tablets, and other mobile devices requiring high bandwidth and low power consumption.

Applications

  • Smartphones
  • Tablets
  • Mobile gaming devices
  • Virtual reality (VR) headsets
  • Automotive infotainment systems

Features

  • LPDDR4 standard for high bandwidth and low power consumption.
  • High-density memory capacity for demanding applications.
  • Fast data transfer rates for smooth performance.
  • Advanced packaging technology for compact size.
  • Wide operating temperature range.

Benefits

  • Enables responsive and fluid user experiences on mobile devices.
  • Supports high-resolution displays and graphics-intensive applications.
  • Extends battery life in portable devices.
  • Reduces system size and weight.
  • Ensures reliable operation in various environmental conditions.

Additional Details

The H9TKNNN4GDMRHR-NGMR memory chip typically features a multi-chip package (MCP) configuration. Key specifications include memory capacity, data transfer rate, operating voltage, and power consumption. Refer to the Hynix Semiconductor datasheet for detailed electrical characteristics, timing diagrams, and application guidelines. Proper PCB layout and signal integrity techniques are essential for optimal performance in high-speed memory applications.

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Shipping Information

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