The H5TQ2GC3MFR-H9C is a DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) chip manufactured by Hynix Semiconductor. It's a 2Gb (Gigabit) memory component designed for applications requiring high-speed data access and moderate power consumption. The memory is organized as 128M x 16.

Applications

• Desktop Computers
• Laptop Computers
• Graphics Cards
• Gaming Consoles
• Networking Equipment

Features

• Capacity: 2Gb (128M x 16)
• Interface: DDR3 SDRAM
• Operating Voltage: 1.5V (Typical)
• Speed Grade: H9C (Specific speed bin determining maximum clock frequency and data rate)
• Data Rate: Supports various data transfer rates depending on the H9C speed grade.
• Clock Frequency: Operates at a clock frequency dictated by the speed grade.
• Package: FBGA (Fine-Pitch Ball Grid Array) for compact size and efficient thermal dissipation.
• RoHS Compliance: Lead-free and compliant with RoHS environmental standards.
• Power-Saving Modes: Includes features to minimize power consumption during idle periods.
• Double Data Rate: Transfers data on both rising and falling edges of the clock signal.

Benefits

• High Bandwidth: DDR3 technology provides a significant improvement in bandwidth compared to older DDR standards.
• Moderate Power: Operates at 1.5V, contributing to lower power consumption.
• Enhanced Performance: Fast data transfer rates contribute to improved system performance in demanding applications.
• Cost-Effective Solution: DDR3 offers a balance between performance and cost.
• Widespread Availability: DDR3 is a mature technology with readily available components and support.
• Reliable Operation: Designed for stable and reliable performance in various operating conditions.

Additional Details

The 'H9C' speed grade is a crucial specification for this part, determining its maximum operating frequency and data transfer rate. Refer to the Hynix datasheet for detailed timing parameters and specifications associated with the H9C speed bin. This device typically uses a prefetch buffer to enhance data throughput. The FBGA package allows for high-density mounting on PCBs. It is common for these chips to be used in creating memory modules.