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H5TQ2G83FFR-PBJ

Part No H5TQ2G83FFR-PBJ
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR3-1600 256Mx8 (2Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941169-H5TQ2G83FFR-PBJ
Series *
Ultra Librarian 3D Model Ultra Librarian H5TQ2G83FFR-PBJ CAD Model

Description

The Hynix H5TQ2G83FFR-PBJ is a 2Gb (Gigabit) DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) component. This memory module is designed for various applications needing moderate memory capacity with reliable performance, including embedded systems, network devices, and consumer electronics.

Applications:

  • Embedded Systems: Primary memory in embedded systems for control and automation.
  • Networking Equipment: Used in routers, switches, and modems for packet buffering and control plane functionality.
  • Consumer Electronics: Memory for set-top boxes, media players, and other multimedia devices.
  • Industrial Computing: RAM for industrial PCs and single-board computers used in manufacturing.

Features:

  • Capacity: 2Gb (Gigabit) DDR3 SDRAM.
  • Organization: Typically organized as 256M x 8.
  • Interface: Standard DDR3 interface, ensuring wide compatibility with various chipsets.
  • Operating Voltage: Operates at 1.5V, providing a balance between performance and power consumption.
  • Data Transfer Rate: Supports high data transfer rates, enhancing overall system responsiveness.
  • Clock Frequency: Compatible with a range of clock frequencies for flexible system configurations.
  • Package: Typically available in FBGA (Fine-Pitch Ball Grid Array) package for space-efficient mounting.
  • RoHS Compliance: Manufactured to meet RoHS standards for environmental safety.

Benefits:

  • Reliable Performance: Provides stable and dependable memory operation in diverse environments.
  • Low Power Consumption: Efficient voltage operation reduces energy consumption and heat generation.
  • Wide Compatibility: DDR3 interface ensures compatibility with a broad range of systems and devices.
  • Space-Saving Design: FBGA package enables compact integration in embedded applications.
  • Enhanced Responsiveness: High data transfer rates contribute to faster application loading and multitasking.

Additional Details:

The H5TQ2G83FFR-PBJ complies with JEDEC standards for DDR3 SDRAM, ensuring interoperability and consistent performance. It incorporates features such as on-die termination (ODT) and prefetch buffering to optimize data transfer and maintain signal integrity. This memory chip provides a reliable and efficient solution for a variety of computing applications, particularly in embedded systems, networking devices, and consumer electronics. Its combination of moderate capacity, speed, and reliability makes it a suitable choice for improving overall system efficiency and performance in diverse environments.

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