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H5TQ1G63DFR-PBCR

Part No H5TQ1G63DFR-PBCR
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR3-1600 64Mx16 (1Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941518-H5TQ1G63DFR-PBCR
Series *
Ultra Librarian 3D Model Ultra Librarian H5TQ1G63DFR-PBCR CAD Model

Description

The Hynix H5TQ1G63DFR-PBCR is a DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) module. DDR3 SDRAM is a widely used type of memory in various computing devices, known for its efficiency and high data transfer rates. This particular module is designed to be used in applications that require significant memory bandwidth and low latency.

Applications:

  • Desktop and Laptop Computers: Serves as the primary system memory, storing actively used data and program instructions for quick access.
  • Servers: Used in server systems to facilitate virtualization, database management, and other memory-intensive tasks.
  • Graphics Cards: Integrated into graphics cards to provide high-speed memory for texture mapping, frame buffering, and various graphics operations.
  • Embedded Systems: Employed in embedded systems needing high-performance memory, such as industrial controllers, networking equipment, and communication devices.
  • Gaming Consoles: Utilized in gaming consoles to provide fast memory access for game data, rendering, and other operations.

Features:

  • Capacity: 1Gb (Gigabit) memory capacity, providing substantial storage for data and instructions.
  • Organization: Organized as 64M x 16, indicating the internal memory array structure and data width.
  • Data Rate: DDR3 interface allows for high data transfer rates, improving the overall performance of the system.
  • Voltage: Operates at a low voltage (typically 1.5V), which reduces power consumption and heat generation.
  • Clock Speed: The PBCR designation specifies a particular speed grade and timing configuration supported by the module.
  • Interface: Employs a standard DDR3 interface, ensuring compatibility with a wide range of systems and motherboards.
  • FBGA Package: Typically packaged in a Fine-Pitch Ball Grid Array (FBGA) for efficient surface mounting and effective thermal dissipation.

Benefits:

  • High Performance: Delivers high-speed data access, contributing to faster system responsiveness and improved performance in demanding applications.
  • Low Power Consumption: Reduces energy usage, making it suitable for energy-efficient systems and extending battery life in portable devices.
  • Increased Bandwidth: Supports high memory bandwidth, essential for applications like gaming, video editing, and scientific computing.
  • Stable Operation: Designed for reliable and stable performance under various operating conditions, ensuring data integrity and system stability.
  • Cost-Effective: Provides a good balance between performance and cost, making it a popular choice for a wide range of applications.

Additional Details:

The part number H5TQ1G63DFR-PBCR comprises several elements: H5 indicates Hynix as the manufacturer, TQ signifies DDR3 technology, 1G represents 1 Gigabit capacity, 63 denotes the memory organization, DFR typically signifies a specific version or revision, and PBCR specifies the speed grade and timing characteristics of the module. For detailed specifications, timing parameters, and compatibility information, refer to the Hynix datasheet.

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