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H5TC2G83FFR-PBA

Part No H5TC2G83FFR-PBA
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR3-1600 256Mx8 (2Gb) 1.35V
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941109-H5TC2G83FFR-PBA
Series *
Ultra Librarian 3D Model Ultra Librarian H5TC2G83FFR-PBA CAD Model

Description

The Hynix H5TC2G83FFR-PBA is a high-performance DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) chip designed for a variety of applications requiring fast and efficient memory access. This component is engineered to provide increased bandwidth and reduced power consumption compared to previous DDR generations.

Applications:

  • Desktop and Laptop Computers: Serves as main system memory, enabling smooth multitasking and efficient program execution.
  • Graphics Cards: Provides memory for storing textures and frame buffers, enhancing gaming and visual performance.
  • Gaming Consoles: Supports high-speed data processing, contributing to responsive and immersive gaming experiences.
  • Networking Equipment: Used in routers, switches, and other networking devices for packet buffering and data processing.
  • Embedded Systems: Integrated into embedded applications requiring high memory bandwidth, such as industrial control systems and digital signage.

Features:

  • DDR3 Technology: Enables faster data transfer rates compared to DDR2, improving overall system performance.
  • High Bandwidth: Provides a wide data path for increased data throughput, essential for demanding applications.
  • Reduced Power Consumption: Operates at a lower voltage compared to DDR2, enhancing energy efficiency.
  • Advanced Packaging: Utilizes advanced packaging technologies for improved thermal performance and reliability.
  • Synchronous Operation: Synchronized with the system clock for efficient data transfer and timing.

Benefits:

  • Enhanced System Performance: Improves overall system performance by providing faster and more efficient memory access.
  • Increased Data Throughput: Enables higher data throughput, reducing bottlenecks and enhancing application performance.
  • Improved Energy Efficiency: Reduces power consumption, extending battery life in portable devices and lowering overall system power usage.
  • Reliable Operation: Designed for stable and dependable performance under various operating conditions.
  • Greater Memory Capacity: Supports larger memory capacities, enabling more complex applications and multitasking capabilities.

Additional Details:

The H5TC2G83FFR-PBA typically operates at a specific voltage (e.g., 1.5V) and has a specific clock speed, which determines its data transfer rate. It is often available in various package types, such as FBGA (Fine-pitch Ball Grid Array), to suit different board designs. The memory chip is designed to meet industry standards for DDR3 SDRAM, ensuring compatibility with a wide range of systems and devices.

For complete technical specifications, including operating temperature ranges, timing parameters, and power consumption characteristics, please refer to the official Hynix datasheet.

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Pricing & Ordering

Quantity Unit Price Ext. Price
7+ $9.1303 $63.9121
16+ $7.4913 $119.8608
24+ $7.2580 $174.1920
33+ $7.0236 $231.7788
43+ $6.7891 $291.9313
57+ $6.0869 $346.9533
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Prices are subject to market and will be confirmed after the order is placed.
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 1,904 pieces
MOQ: 7 pcs
Order Increment : 1 pcs
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