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H5TC2G83EFR-H9A

Part No H5TC2G83EFR-H9A
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR3-1333 256Mx8 (2Gb) 1.35V
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941106-H5TC2G83EFR-H9A
Series *
Ultra Librarian 3D Model Ultra Librarian H5TC2G83EFR-H9A CAD Model

Description

The Hynix H5TC2G83EFR-H9A is a 2Gb DDR3 SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) component. It's designed for applications requiring high memory bandwidth and energy efficiency, such as laptops, desktops, embedded systems, and networking devices. This memory chip offers improved performance and lower power consumption compared to previous generations of SDRAM.

Applications:

  • Laptops
  • Desktops
  • Embedded Systems
  • Networking Devices
  • Consumer Electronics

Features:

  • Capacity: 2Gb (256M x 8)
  • Interface: DDR3 SDRAM
  • Clock Frequency: Specified by the speed grade (H9A) - typically up to 800 MHz (1600 MHz effective)
  • Voltage: 1.5V
  • Data Rate: Up to 1600 Mbps
  • Operating Temperature Range: Commercial
  • Package: FBGA (Fine-pitch Ball Grid Array)
  • Double data rate architecture: Enables high-speed data transfer.
  • On-chip DLL (Delay-Locked Loop): Provides precise data timing control.
  • Write latency = Read latency - 1 clock cycle
  • Burst Length: 8

Benefits:

  • Enhanced Performance: DDR3 interface provides faster data transfer rates.
  • Reduced Power Consumption: Operates at 1.5V, improving energy efficiency.
  • Improved Memory Access: Enhances system responsiveness and overall performance.
  • Reliable Operation: Ensures stable performance across diverse applications.
  • Compact Design: FBGA package allows for dense PCB layouts.

Additional Details:

The H5TC2G83EFR-H9A uses a DDR3 architecture, which allows data to be transferred on both the rising and falling edges of the clock signal, effectively doubling the data rate compared to single data rate SDRAM. The on-chip DLL ensures accurate data timing, minimizing skew and maximizing performance. Packaged in a FBGA, this component provides excellent thermal performance and supports high-density PCB designs. This DDR3 SDRAM is well-suited for applications requiring a balance of high speed, low power, and reliable operation.

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