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H5TC2G43EFR-H9A

Part No H5TC2G43EFR-H9A
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR3-1333 512Mx4 (2Gb) 1.35V
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941081-H5TC2G43EFR-H9A
Series *
Ultra Librarian 3D Model Ultra Librarian H5TC2G43EFR-H9A CAD Model

Description

The Hynix H5TC2G43EFR-H9A is a 2Gb DDR3 SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) component. Designed for applications requiring high bandwidth and low power consumption, this chip is suitable for laptops, desktops, servers, and embedded systems. Its DDR3 interface enables faster data transfer rates compared to previous generations, improving overall system performance and efficiency.

Applications:

  • Laptops
  • Desktops
  • Servers
  • Embedded Systems
  • Networking Devices

Features:

  • Capacity: 2Gb (256M x 8)
  • Interface: DDR3 SDRAM
  • Clock Frequency: Specified by the speed grade (H9A) - typically up to 800 MHz (1600 MHz effective)
  • Voltage: 1.5V
  • Data Rate: Up to 1600 Mbps
  • Operating Temperature Range: Commercial
  • Package: FBGA (Fine-pitch Ball Grid Array)
  • Double data rate architecture: Provides high-speed data transfer capabilities.
  • On-chip DLL (Delay-Locked Loop): Ensures precise data timing.
  • Write latency = Read latency - 1 clock cycle
  • Burst Length: 8

Benefits:

  • Enhanced Bandwidth: DDR3 interface offers faster data transfer rates.
  • Reduced Power Consumption: Operates at 1.5V, improving energy efficiency.
  • Improved Performance: Faster memory access enhances system responsiveness.
  • Reliable Operation: Stable performance in a variety of applications.
  • Compact Design: FBGA package allows for high-density PCB designs.

Additional Details:

The H5TC2G43EFR-H9A leverages the DDR3 architecture, transferring data on both the rising and falling edges of the clock signal to achieve high bandwidth. The on-chip DLL ensures accurate data timing, minimizing skew and maximizing performance. Packaged in a FBGA, this component provides excellent thermal performance and supports high-density PCB layouts. It is an ideal choice for applications that demand high-speed and reliable memory access with improved energy efficiency.

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