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H5PS5142FFP-S5C-C

Part No H5PS5142FFP-S5C-C
Manufacturer Hynix Semiconductor
Catalog DDR
Description GDDR2 32Mx4
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 943937-H5PS5142FFP-S5C-C
Series *
Ultra Librarian 3D Model Ultra Librarian H5PS5142FFP-S5C-C CAD Model

Description

The H5PS5142FFP-S5C-C is a DDR SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) component manufactured by Hynix Semiconductor. This memory chip is designed for applications where memory bandwidth and capacity are important. The 'DDR' architecture allows for data transfer on both the rising and falling edges of the clock signal, effectively doubling the data transfer rate compared to single data rate (SDR) SDRAM.

Applications

  • Graphics cards
  • Set-top boxes
  • Gaming consoles
  • Networking equipment
  • Other embedded systems requiring external memory

Features

  • Capacity: 512Mb (This can also be interpreted as 64M x 8)
  • DDR: Double Data Rate architecture for increased bandwidth
  • Data Transfer Rate: Typically supports data transfer rates up to 400MHz, but actual speeds depend on the specific grade
  • Clock Frequency: It works with clock frequencies typically around 200 MHz, but specific frequency depends on speed grade.
  • Interface: Industry-standard DDR interface
  • Power Supply: Typically operates at 2.5V
  • Package: FBGA (Fine-Pitch Ball Grid Array) package
  • RoHS Compliant: Likely to be lead-free and compliant with RoHS environmental standards

Benefits

  • High Bandwidth: DDR technology allows for increased data throughput, boosting overall system performance.
  • Adequate Memory Capacity: The 512Mb capacity provides enough space for many embedded and consumer electronic applications.
  • Power Efficiency: Designed to minimize power consumption.
  • Ease of Integration: Adherence to the DDR standard simplifies design and integration.
  • Reliability: Hynix is known for high-quality and reliable memory components.

Additional Details

The H5PS5142FFP-S5C-C is well-suited for a variety of applications where memory bandwidth and density are important considerations. The FBGA package allows for a compact design and good thermal performance. The specific speed grade represented by the 'S5C' part of the identifier, impacts the achievable clock and data rates. The 'C' suffix may indicate a specific temperature range or other characteristic. Designers should consult the Hynix datasheet for comprehensive timing and electrical characteristics to ensure proper system operation and maximize performance. Key timing parameters such as CAS latency (CL) are important for optimal performance. Understanding and adhering to the specifications outlined in the official Hynix documentation is essential for a successful implementation.

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