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H5PS2G43AFR-S6C

Part No H5PS2G43AFR-S6C
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR2-800 512Mx4
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941910-H5PS2G43AFR-S6C
Series *
Ultra Librarian 3D Model Ultra Librarian H5PS2G43AFR-S6C CAD Model

Description

The Hynix H5PS2G43AFR-S6C is a 2Gb DDR2 SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) chip. It's designed to provide high bandwidth and efficient memory access for applications such as graphics cards, embedded systems, and high-performance computing platforms. This component offers a balance of speed, capacity, and power consumption, making it suitable for a wide range of applications.

Applications:

  • Graphics Cards
  • Embedded Systems
  • High-Performance Computing
  • Networking Devices
  • Digital TVs

Features:

  • Capacity: 2Gb (256M x 8)
  • Interface: DDR2 SDRAM
  • Clock Frequency: Specified by the speed grade (S6C) - typically up to 400 MHz (800 MHz effective)
  • Voltage: 1.8V
  • Data Rate: Up to 800 Mbps
  • Operating Temperature Range: Commercial
  • Package: FBGA (Fine-pitch Ball Grid Array)
  • Double data rate architecture: Transfers data on both clock edges.
  • On-chip DLL (Delay-Locked Loop): Provides precise data timing.
  • Write latency = Read latency - 1 clock cycle
  • Burst Length: 4 or 8

Benefits:

  • High Bandwidth: DDR2 interface delivers fast data transfer.
  • Efficient Memory Access: Enhances system responsiveness.
  • Low Power Consumption: Operates at 1.8V, reducing energy usage.
  • Reliable Operation: Ensures stability across diverse applications.
  • Compact Design: FBGA package allows for dense PCB layouts.

Additional Details:

The H5PS2G43AFR-S6C leverages DDR2 architecture to achieve high bandwidth by transferring data on both the rising and falling edges of the clock signal. This doubles the effective data rate compared to single data rate SDRAM. The on-chip DLL ensures that data is accurately timed and placed, reducing skew and improving overall performance. Packaged in a FBGA, this component provides excellent thermal characteristics and supports high-density PCB designs. It is an excellent solution for applications that require a balance of speed, capacity, and power efficiency.

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