The H5AN8G8NDJR-XNC is an 8Gb DDR4 SDRAM component manufactured by Hynix Semiconductor. This high-capacity DRAM chip is designed for demanding memory applications, providing ample space and speed for data storage and retrieval. It adheres to the DDR4 standard, offering enhanced performance, reduced power consumption, and improved reliability compared to older DDR technologies.

Applications

• High-Performance Desktops: Used as main system memory, boosting application performance and multitasking capabilities.
• Gaming Rigs: Supports high frame rates and smooth gameplay by providing fast memory access.
• Servers: Provides large memory capacity for server applications, virtualization, and data processing tasks.
• Workstations: Handles memory-intensive tasks in professional workstations used for video editing, 3D rendering, and scientific simulations.
• Industrial PCs: Employed in industrial computing environments requiring reliable and high-speed memory.

Features

• Capacity: 8Gb (Gigabits) capacity provides plenty of space for modern applications and large datasets.
• DDR4 Technology: Fully compliant with the DDR4 standard, ensuring compatibility and optimal performance.
• High Bandwidth: Supports high data transfer rates, reducing latency and improving overall system responsiveness.
• Low Voltage: Operates at a low voltage (typically 1.2V), minimizing power consumption and heat dissipation.
• FBGA Package: Uses a fine-pitch ball grid array (FBGA) package for efficient PCB mounting and signal integrity.
• RoHS Compliant: Manufactured in accordance with RoHS environmental standards, restricting the use of hazardous substances.

Benefits

• Increased System Speed: Significantly improves system responsiveness and application loading times.
• Enhanced Multitasking: Allows for smooth execution of multiple applications simultaneously without performance degradation.
• Reduced Power Consumption: Low-voltage operation contributes to lower power consumption and reduced heat output.
• Improved Reliability: Provides stable and reliable memory performance for demanding applications.
• Greater Memory Density: Offers a large memory capacity in a compact physical package.

Additional Details

The H5AN8G8NDJR-XNC is designed to work with specific timing parameters and frequencies defined by the DDR4 standard. It features on-die termination (ODT) to improve signal quality and reduce reflections. For detailed technical specifications, including operating temperature ranges and detailed timing characteristics, refer to the official Hynix Semiconductor datasheet for this specific part number.