The H5AN4G6NBJR-UHCR is a 4Gb DDR4 SDRAM component from Hynix Semiconductor. This memory chip is engineered for high-speed data processing in various computing applications, providing a balance of performance and power efficiency.

Applications:

• High-performance desktops
• Gaming laptops
• Workstations
• Server memory modules
• Embedded computing platforms

Features:

• 4Gb (256M x 16) memory organization
• DDR4 interface supporting speeds up to 2666 MT/s or higher, depending on the specific binning.
• 1.2V operating voltage for reduced power consumption
• On-Die Termination (ODT) to improve signal integrity and reduce reflections
• RoHS compliant and lead-free

Benefits:

• Enhanced system responsiveness due to faster data transfer rates.
• Improved energy efficiency, leading to longer battery life in mobile applications and reduced operating costs in servers.
• Increased system stability and reliability due to better signal integrity.
• Environmentally friendly design.

Additional Details:

The H5AN4G6NBJR-UHCR is built to meet the increasing demands for bandwidth and memory capacity in modern computing environments. The DDR4 architecture offers significant advantages over previous generations of memory, including higher clock speeds, lower voltage requirements, and improved reliability. The 4Gb density makes it suitable for a wide range of applications, from consumer electronics to enterprise servers. The on-die termination feature helps to minimize signal reflections, ensuring that data is transmitted accurately and reliably. The 1.2V operating voltage reduces power consumption, making it an ideal choice for energy-efficient systems.

The 'UHCR' suffix likely denotes specific performance characteristics or binning of the chip, which impacts the maximum achievable clock speed and timings. Further investigation into the Hynix datasheet would provide the exact specifications for parameters like CAS Latency (CL), tRCD, tRP, and tRAS. These timings are critical for ensuring compatibility and optimal performance in different systems. The package type is typically FBGA (Fine-Pitch Ball Grid Array), which allows for high-density mounting on printed circuit boards.