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H5AN4G6NBJR-TFC

Part No H5AN4G6NBJR-TFC
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR4-2133 256Mx16 (4Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 940345-H5AN4G6NBJR-TFC
Series *
Ultra Librarian 3D Model Ultra Librarian H5AN4G6NBJR-TFC CAD Model

Description

The Hynix H5AN4G6NBJR-TFC is a 4Gb (Gigabit) DDR4 SDRAM (Synchronous Dynamic Random-Access Memory) component. It is designed for high-performance memory applications requiring substantial bandwidth and low power consumption. DDR4 SDRAM is the successor to DDR3, offering improved speed, higher density, and lower voltage operation.

Applications:

  • Desktop PCs: Used as main system memory to support multitasking and demanding applications.
  • Laptops: Provides high-speed memory for portable computing devices.
  • Servers: Essential for server systems requiring large amounts of memory for virtualization, database management, and cloud computing.
  • Workstations: Supports professional applications like video editing, 3D rendering, and scientific simulations.
  • Gaming PCs: Enhances gaming performance by providing fast data access for textures, models, and game logic.

Features:

  • Capacity: 4Gb (512M x 8) organization.
  • Interface: DDR4, offering high-speed data transfer rates.
  • Operating Voltage: Typically operates at 1.2V, providing energy efficiency.
  • Data Rate: Supports data transfer rates up to a specific speed grade (details depend on the specific TFC binning).
  • Internal Banks: Organized into multiple internal banks to allow concurrent operations and improve memory throughput.
  • Burst Length: Supports burst lengths of 8 and burst chop of 4.
  • Temperature Range: Designed to operate within a specified industrial or commercial temperature range.

Benefits:

  • High Performance: DDR4 technology provides significantly higher bandwidth compared to DDR3, resulting in faster application loading and improved system responsiveness.
  • Low Power Consumption: Operates at a lower voltage (1.2V), reducing power consumption and heat generation.
  • Increased Density: Higher density allows for larger memory modules, enabling support for memory-intensive applications.
  • Improved Reliability: Advanced error correction features enhance data integrity and system stability.
  • Enhanced Multitasking: Larger memory capacity and faster data transfer rates enable smoother multitasking and improved overall system performance.

Additional Details:

The H5AN4G6NBJR-TFC utilizes a high-speed CMOS circuit design. It complies with JEDEC standards for DDR4 SDRAM. The specific speed grade (e.g., 2400MHz, 2666MHz, 3200MHz) will affect the maximum achievable data transfer rate. The part number indicates specific timings, voltage, and temperature grade which are factors in determining compatibility. Always refer to the manufacturer's datasheet for precise specifications and compatibility information to ensure correct operation and optimal performance within a system.

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Pricing & Ordering

Quantity Unit Price Ext. Price
12+ $4.8972 $58.7664
29+ $4.0182 $116.5278
45+ $3.8924 $175.1580
62+ $3.7665 $233.5230
80+ $3.6417 $291.3360
107+ $3.2652 $349.3764
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Prices are subject to market and will be confirmed after the order is placed.
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 9,297 pieces
MOQ: 12 pcs
Order Increment : 1 pcs
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