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H27QCG882M-DA

Part No H27QCG882M-DA
Manufacturer Hynix Semiconductor
Catalog IT infrastructure Memory
Description 64Gb(8GB) NAND Flash Wafe TLC
Sample
Rohs State Need to verify
ECAD Module
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Category IT infrastructure Memory
Win Source Part Number 1453712-H27QCG882M-DA
Manufacturer Hynix Semiconductor
Ultra Librarian 3D Model Ultra Librarian H27QCG882M-DA CAD Model

Description

The H27QCG882M-DA is a NAND Flash memory chip from SK hynix, featuring a substantial storage capacity of 64Gb, which equates to 8GB. This device utilizes Triple-Level Cell (TLC) technology to store three bits of data per cell, effectively enhancing its storage density and capacity. The 'Wafe TLC' designation indicates its efficiency and high-capacity storage solutions, making it suitable for a wide variety of applications that demand large-scale data storage and high-speed data processing. SK hynix, known for its innovative semiconductor solutions, ensures that the H27QCG882M-DA meets the highest standards of reliability and performance. This memory chip is designed to withstand extensive read/write cycles, thus ensuring data integrity and durability over time. Its application spans across multiple digital devices, including but not limited to, advanced smartphones, SSDs, and other electronic devices necessitating high storage capacity and fast data access. The H27QCG882M-DA represents SK hynix's commitment to advancing flash memory technology, offering a reliable and efficient storage solution for the ever-growing demands of the digital world.

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