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HA1306W

Part No HA1306W
Manufacturer Hitachi, Ltd
Catalog OEM Parts (F - I)
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

RoHS Non-Compliant
Win Source Part Number 1061666-HA1306W
Categories OEM Parts(F-I)
Manufacturer Hitachi, Ltd
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian HA1306W CAD Model

Description

The HA1306W is an audio power amplifier IC designed for car audio systems. Manufactured by Hitachi, Ltd, this integrated circuit is engineered to deliver high-quality audio output with minimal external components. It is a robust and reliable solution for amplifying audio signals in automotive environments.

Applications

  • Car audio systems
  • Automotive entertainment units
  • Amplifiers for portable audio devices

Features

  • High output power capability
  • Built-in thermal shutdown protection
  • Short-circuit protection
  • Low distortion
  • Minimal external components required
  • Wide operating voltage range
  • Mute function

Benefits

  • Enhanced audio experience in vehicles due to high-quality amplification.
  • Increased system reliability due to built-in protection features against thermal overload and short circuits.
  • Simplified circuit design and reduced BOM (Bill of Materials) costs because of the minimal external component requirement.
  • Improved audio clarity and fidelity because of the low distortion characteristics.
  • Adaptable to various automotive power supply systems due to the wide operating voltage range.
  • Reduced power consumption during periods of inactivity with the mute function.

Additional Details

The HA1306W operates using a BTL (Bridge-Tied Load) configuration, maximizing the power output to the speakers. It is typically packaged in a multi-lead package suitable for surface mounting on PCBs. The thermal shutdown protection prevents the IC from overheating under heavy load conditions, ensuring stable and reliable operation. The short-circuit protection safeguards the IC and the audio system against damage from wiring faults. The device requires appropriate heat sinking to manage thermal dissipation under high power output conditions.

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Shipping Information

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