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GS8662Q18H-250

Part No GS8662Q18H-250
Manufacturer GSI Technology
Catalog RAM
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1061242-GS8662Q18H-250
Categories RAM
Manufacturer GSI Technology
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian GS8662Q18H-250 CAD Model

Description

The GS8662Q18H-250 is a high-speed synchronous burst SRAM (Static Random-Access Memory) manufactured by GSI Technology. Designed for applications requiring rapid data access and high bandwidth, it operates at a frequency of 250 MHz and features a 18-bit data bus.

Applications

  • Networking: High-speed routers, switches, and network interface cards (NICs).
  • Telecommunications: Data transmission equipment and communication systems.
  • Test and Measurement: High-performance test equipment, logic analyzers, and signal generators.
  • Image and Video Processing: Real-time image processing and video streaming applications.
  • High-Performance Computing: Servers, workstations, and embedded systems requiring fast memory.

Features

  • High Speed: Operates at 250 MHz for rapid data access.
  • 18-Bit Data Bus: Provides a wide data path for increased bandwidth.
  • Synchronous Burst Architecture: Enables efficient burst read and write operations.
  • LVTTL Compatible: Compatible with standard LVTTL logic levels.
  • JEDEC Standard Pinout: Simplifies integration and board layout.

Benefits

  • Increased System Performance: Delivers fast memory access for improved application performance.
  • High Bandwidth: Enables high-speed data transfer.
  • Simplified Design: Standard pinout facilitates easy system integration.
  • Reliable Operation: Designed for dependable performance in demanding applications.

This SRAM is typically fabricated using advanced CMOS technology for low power consumption and high performance. It probably supports various burst modes to optimize data throughput. The GS8662Q18H-250 likely incorporates on-chip address and control logic, simplifying memory management and reducing external component count. Further details such as memory capacity and specific operating characteristics can usually be found in the device datasheet.

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