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GS81302Q18GE-300

Part No GS81302Q18GE-300
Manufacturer GSI Technology
Catalog Memory
Description 144Mb SigmaQuadTM-II Burst of 2 SRAM
Sample
Rohs State rohs
ECAD Module
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Manufacturer GSI Technology
Win Source Part Number 1177765-GS81302Q18GE-300
Manufacturer Homepage www.gsitechnology.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian GS81302Q18GE-300 CAD Model

Description

The GS81302Q18GE-300 is a high-performance synchronous burst quad data rate (QDR) SRAM memory device manufactured by GSI Technology. It's designed for applications requiring very high bandwidth and low latency data access. With a capacity of 144Mbit (8M x 18), it's well-suited for demanding networking and data processing tasks.

Applications:

  • Networking: Used in high-speed routers, switches, and network interface cards (NICs).
  • Data Centers: Suitable for high-performance servers and storage systems.
  • Telecommunications: Employed in telecom infrastructure equipment requiring rapid data processing.
  • Test and Measurement: Utilized in high-speed test equipment and analyzers.
  • Image Processing: Applied in advanced image processing systems needing fast memory.

Features:

  • QDR SRAM: Quad data rate architecture enables extremely high bandwidth.
  • 144Mbit (8M x 18) Density: Provides significant memory capacity for demanding applications.
  • 300 MHz Clock Speed: Supports high-speed operation up to 300 MHz.
  • Burst Read and Write: Supports efficient burst transfers for high data throughput.
  • On-Chip Termination: Integrated termination resistors reduce signal reflections and improve signal integrity.
  • Multiple Power Supply Options: Offers flexibility in power supply configurations.

Benefits:

  • Increased Bandwidth: QDR architecture provides significantly higher bandwidth compared to traditional SRAM.
  • Reduced Latency: Fast access times minimize latency in critical data paths.
  • Improved System Performance: High-speed operation enhances overall system performance.
  • Simplified System Design: On-chip termination simplifies board layout and reduces component count.
  • Enhanced Signal Integrity: Integrated termination improves signal integrity for reliable operation.

Additional Details:

The GS81302Q18GE-300 operates at a core voltage of typically 1.8V with I/O voltages of 1.5V or 1.8V, offering flexibility in power supply design. It is packaged in a ball grid array (BGA) for high-density mounting on PCBs. The device is designed to meet the demanding requirements of high-bandwidth networking and data processing applications. Detailed specifications and application notes can be found in the manufacturer's datasheet.

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