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Same model may have multiple batches, images only for reference.
GD25LD40CEIGR Real Image
Same model may have multiple batches, images only for reference.

GD25LD40CEIGR

Part No GD25LD40CEIGR
Manufacturer GigaDevice Semiconductor
Catalog Unclassified Memory
Description IC FLSH 4MBIT SPI/DUAL I/O 8USON
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 19 Weeks
Features FLASH - NOR Memory IC 4Mb (512K x 8) SPI - Dual I/O 50 MHz 8-USON (2x3)
Manufacturer GigaDevice Semiconductor
Package Reel - TR
Operating Temperature Range -40°C ~ 85°C (TA)
Mounting Surface Mount
Package 8-XFDFN Exposed Pad
Case / Package 8-USON (2x3)
Family Name GD25LD40
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0071
Quantity per package 3000
Popularity Medium
Supply and Demand Status Limited
Win Source Part Number 872686-GD25LD40CEIGR
Ultra Librarian 3D Model Ultra Librarian GD25LD40CEIGR CAD Model

Description

The GigaDevice Semiconductor GD25LD40CEIGR is a flash - NOR memory IC used in integrated circuits (ICs).

  • Memory Type: Flash - NOR
  • Memory Size: 4Mb (512K x 8)
  • Memory Interface: SPI - Dual I/O 50 MHz 8-USON (2x3)
  • Manufacturer: GigaDevice Semiconductor
  • Win Source Part Number: 872686-GD25LD40CEIGR
  • Supply and Demand Status: Limited
  • Package Type: Reel - TR
  • Operating Temperature: -40°C to 85°C (TA)
  • ECCN: EAR99
  • REACH: Unaffected
  • MSL Level: 3 (168 Hours)
  • Estimated Production Lead Time: 19 weeks

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