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XPC603FE75-2B

Part No XPC603FE75-2B
Manufacturer Freescale Semiconductor - NXP
Catalog HOT - SALES and EOL Components (U - Z)
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Manufacturer Freescale Semiconductor - NXP
Win Source Part Number 410317-XPC603FE75-2B
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian XPC603FE75-2B CAD Model

Description

The XPC603FE75-2B is a PowerPC microprocessor from Freescale Semiconductor (NXP). It belongs to the MPC603e family of processors, known for their efficient performance and low power consumption. This processor is designed for embedded applications requiring robust performance and power efficiency.

Applications

  • Networking equipment (routers, switches)
  • Industrial control systems
  • Telecommunications infrastructure
  • Embedded computing platforms
  • Single Board Computers

Features

  • PowerPC architecture: Based on the proven PowerPC architecture, offering a balance of performance and power efficiency.
  • Clock Speed: Features a 75 MHz clock speed.
  • 32-bit processing: Capable of handling 32-bit data, providing sufficient bandwidth for many embedded tasks.
  • Low power consumption: Designed for power-sensitive applications, minimizing heat generation and extending battery life.
  • Integrated MMU (Memory Management Unit): Provides memory protection and virtual memory capabilities.
  • On-chip caches: L1 instruction and data caches improve performance by reducing memory access latency.
  • Compact package: Available in a compact package suitable for space-constrained applications.
  • High integration: Integrates key functionalities to reduce external component count and system cost.

Benefits

  • Improved system performance: Enables faster execution of applications, resulting in improved system responsiveness.
  • Reduced power consumption: Minimizes energy usage, leading to longer battery life and reduced operating costs.
  • Enhanced system reliability: Robust design ensures stable operation in harsh environments.
  • Simplified system design: Integrated features reduce the need for external components, simplifying system design and reducing time-to-market.
  • Cost-effective solution: Provides a balance of performance, power efficiency, and cost, making it an ideal choice for a wide range of embedded applications.

Additional Details

The XPC603FE75-2B is typically packaged in a BGA (Ball Grid Array) package. It supports various memory interfaces, including SDRAM and SRAM. It also offers a range of peripheral interfaces, such as UART, Ethernet, and PCI. The operating voltage is typically 3.3V. Detailed specifications can be found in the Freescale (NXP) MPC603e family documentation.

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