The ELM3083(TB)-V is a molded type infrared emitting diode (IRED) from Everlight Electronics. These devices are designed for applications requiring efficient infrared light emission. They are commonly used in remote control systems, light barriers, and other optoelectronic devices where reliable infrared signaling is crucial.
Applications:
- Remote control systems: Transmitting control signals in TVs, DVD players, and other electronic devices.
- Light barriers: Detecting the presence or absence of an object by interrupting an infrared beam.
- Optoelectronic sensors: Used in various sensor applications requiring infrared detection.
- Infrared data transmission: For short-range wireless data communication.
- Security systems: Used in motion detectors and other security devices.
Features:
- High radiant intensity: Provides strong infrared light output for reliable signaling.
- Molded type package: Offers good mechanical strength and environmental protection.
- Peak wavelength of 850nm: Optimized for use with silicon photodetectors.
- Narrow viewing angle: Directs the infrared light in a focused beam.
- Low forward voltage: Reduces power consumption.
- High reliability: Ensures long-term performance in demanding applications.
Benefits:
- Efficient infrared transmission: Enables reliable and effective remote control and sensing.
- Durable and robust: Withstands harsh environmental conditions.
- Compatibility with silicon photodetectors: Simplifies circuit design.
- Low power consumption: Extends battery life in portable devices.
- Long lifespan: Reduces the need for frequent replacements.
- Cost-effective solution: Offers a good balance of performance and price.
Additional Details:
The ELM3083(TB)-V IRED has a typical forward voltage of around 1.2V at a forward current of 20mA. Its radiant intensity is specified at a specific forward current, typically measured in mW/sr (milliwatts per steradian). The peak emission wavelength is typically 850nm, which is well-suited for use with silicon phototransistors and photodiodes.
The package is designed for through-hole mounting. Care should be taken during soldering to avoid overheating the device. Refer to the manufacturer's datasheet for specific soldering recommendations and other important handling precautions.
The 'TB' suffix likely indicates a specific taping or packaging option. The '-V' suffix might represent a specific voltage or binning characteristic of the device.