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SLG46621V-DIP

Part No SLG46621V-DIP
Manufacturer Dialog Semiconductor GmbH
Catalog Evaluation Boards - Embedded - ComplexLogic (FPGA, CPLD)
Description 20-PIN DIP PROTO BOARD SLG46621 / SLG46621 series CPLD Evaluation Board
Sample
Rohs State rohs
ECAD Module
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Category Development Boards, Kits, Programmers>Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Mfr Dialog Semiconductor GmbH
Series GreenPAK™
Package Bulk
Type CPLD
For Use With/Related Products SLG46621
Contents Board(s)
Base Product Number SLG46621
MSL Level 1 (Unlimited)
HTSUS 0000.00.0000
Standard Package 1
Win Source Part Number 979228-SLG46621V-DIP
Ultra Librarian 3D Model Ultra Librarian SLG46621V-DIP CAD Model

Description

The SLG46621V-DIP is a member of the GreenPAK family of programmable mixed-signal ASICs from Dialog Semiconductor (formerly Silego). This device allows designers to integrate multiple discrete components into a single IC, reducing board space, cost, and power consumption. The 'DIP' suffix suggests it's available in a Dual In-line Package, which is less common these days but can be useful for prototyping or hobbyist projects.

Applications

  • Prototyping: The DIP package makes it easy to experiment with the GreenPAK features on a breadboard before committing to a surface-mount design.
  • Hobbyist Projects: Suitable for DIY electronics projects where a programmable logic device is needed.
  • Educational Purposes: Can be used in electronics courses to teach digital logic design and mixed-signal circuits.
  • Legacy System Replacement: Can replace multiple discrete components in older designs to improve reliability and reduce size.
  • Simple Control Circuits: Useful for implementing basic control functions in various applications.

Features

  • Programmable Logic: Contains configurable logic blocks that can be programmed to implement custom digital circuits.
  • Mixed-Signal Capabilities: Includes analog comparators and other analog resources that can be used for signal conditioning and processing.
  • Integrated Power Management: Features integrated power management circuitry for efficient power consumption.
  • DIP Package: Available in a Dual In-line Package for easy prototyping.
  • Low Power Consumption: Designed for low-power operation, making it suitable for battery-powered applications.

Benefits

  • Easy Prototyping: The DIP package allows for easy experimentation and prototyping on a breadboard.
  • Reduced BOM Cost: Integrates multiple discrete components into a single IC, reducing the bill of materials cost.
  • Smaller Board Size (Compared to discrete): While DIP isn't as space-efficient as surface mount, it's still smaller than using all discrete components.
  • Faster Time to Market: Simplifies design and prototyping with its configurable architecture.
  • Increased Design Flexibility: Allows designers to implement custom logic and mixed-signal circuits without relying on standard components.

Additional Details: The SLG46621V-DIP is programmed using Dialog's GreenPAK Designer software. It typically operates over a voltage range of 1.8V to 5.5V. The device includes a number of digital macrocells, analog comparators, and other configurable resources. The DIP package allows for easy insertion into breadboards and through-hole PCBs. Keep in mind that the SLG46621V is just one variant of GreenPAK, and the specific features may vary in other GreenPAK devices.

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