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Same model may have multiple batches, images only for reference.
CY7C2245KV18-450BZXI Real Image
Same model may have multiple batches, images only for reference.

CY7C2245KV18-450BZXI

Part No CY7C2245KV18-450BZXI
Manufacturer Cypress Semiconductor Corp
Catalog SRAM
Description IC SRAM 36MBIT PARALLEL 165FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 39 Weeks
Features SRAM - Synchronous, QDR II+ Memory IC 36Mb (1M x 36) Parallel 165-FBGA (13x15)
Manufacturer Cypress Semiconductor Corp
Package Tray
Operating Temperature Range -40°C ~ 85°C (TA)
Mounting Surface Mount
Package 165-LBGA
Case / Package 165-FBGA (13x15)
Family Name CY7C2245
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2A
HTSUS 8542.32.0041
Other Part Number 2015-CY7C2245KV18-450BZXI, -CY7C2245KV18-450BZXI
Quantity per package 136
Popularity High
Supply and Demand Status Balance
Win Source Part Number 916460-CY7C2245KV18-450BZXI
Ultra Librarian 3D Model Ultra Librarian CY7C2245KV18-450BZXI CAD Model

Description

The product is categorized under Integrated Circuits (ICs) and has a package size of 165-LBGA.

  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package Type: Tray
  • Quantity per Package: 136
  • Lead Time: Estimated production lead time of 39 weeks.

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