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Same model may have multiple batches, images only for reference.
CY7C1625KV18-250BZXC Real Image
Same model may have multiple batches, images only for reference.

CY7C1625KV18-250BZXC

Part No CY7C1625KV18-250BZXC
Manufacturer Cypress Semiconductor Corp
Catalog SRAM
Description IC SRAM 144MBIT PARALLEL 165FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 39 Weeks
Features SRAM - Synchronous, QDR II Memory IC 144Mb (16M x 9) Parallel 165-FBGA (15x17)
Manufacturer Cypress Semiconductor Corp
Package Tray
Operating Temperature Range 0°C ~ 70°C (TA)
Mounting Surface Mount
Package 165-LBGA
Case / Package 165-FBGA (15x17)
Family Name CY7C1625
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2A
HTSUS 8542.32.0041
Other Part Number CY7C1625KV18250BZXC, 2015-CY7C1625KV18-250BZXC, -CY7C1625KV18-250BZXC
Quantity per package 105
Popularity Medium
Supply and Demand Status Limited
Win Source Part Number 867743-CY7C1625KV18-250BZXC
Ultra Librarian 3D Model Ultra Librarian CY7C1625KV18-250BZXC CAD Model

Description

The Cypress Semiconductor Corp CY7C1625KV18-250BZXC is a medium popularity electronic component that has a limited supply and demand status.

  • Category: Integrated Circuits (ICs)
  • Package Size: 165-LBGA
  • Component Type: SRAM - Synchronous, QDR II Memory IC 144Mb (16M x 9) Parallel 165-FBGA (15x17)
  • Operating Temperature Range: 0°C ~ 70°C (TA)
  • Quantity per Package: 105
  • MSL Level: 3 (168 Hours)
  • Estimated Production Lead Time: 39 weeks
  • REACH: unaffected
  • HTSUS: 8542.32.0041
  • Other Part Numbers: CY7C1625KV18250BZXC, 2015-CY7C1625KV18-250BZXC, -CY7C1625KV18-250BZXC

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