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CY7C1360C-166BGC

Part No CY7C1360C-166BGC
Manufacturer Cypress Semiconductor Corp
Catalog END - OF - LIFE
Description 9-Mbit (256K x 36/512K x 18) Pipelined SRAM
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Manufacturer Cypress Semiconductor Corp
Win Source Part Number 1165047-CY7C1360C-166BGC
Manufacturer Homepage www.cypress.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian CY7C1360C-166BGC CAD Model

Description

The CY7C1360C-166BGC is a synchronous pipelined burst SRAM (Static Random-Access Memory) produced by Cypress Semiconductor Corp. It is specifically engineered for high-speed applications demanding rapid data access and high bandwidth. This particular model is designated as END-OF-LIFE, indicating that it is no longer in active production or supported by the manufacturer.

Applications

  • Networking Equipment: Routers and switches utilize this SRAM for packet buffering and high-speed data transfer.
  • Telecommunications Systems: Employed in wireless base stations and other telecommunications infrastructure.
  • High-Performance Computing: Used in cache memory and other applications requiring quick data retrieval.
  • Data Acquisition Systems: Integral for high-speed data capture in test and measurement equipment.
  • Image and Video Processing: Functions as a frame buffer in image and video processing applications.

Features

  • High Clock Frequency: Operates at a clock frequency of 166 MHz, facilitating rapid data transfer.
  • Synchronous Pipelined Burst Architecture: Optimizes data throughput for enhanced performance.
  • 3.3V Power Supply: Designed to operate at a 3.3V power supply voltage.
  • Global Write Enable: Allows for simultaneous writing to all memory locations.
  • Byte Write Enable: Enables selective writing to individual bytes within a word.
  • BGA Package: Available in a BGA (Ball Grid Array) package, providing high pin density and improved thermal performance.

Benefits

  • Enhanced System Performance: The high clock frequency and synchronous burst architecture significantly improve system performance.
  • Reduced Latency: Synchronous operation ensures minimal latency in data access.
  • Flexible Write Operations: Byte write enable provides flexibility in data manipulation.
  • Simplified System Design: The BGA package allows for a more compact and efficient board layout.
  • Improved Thermal Management: BGA package enhances heat dissipation for reliable operation.

Additional Details

The CY7C1360C-166BGC incorporates a burst counter to efficiently manage data transfers in burst mode. Its synchronous design ensures that all data transfers are synchronized with the clock signal, providing predictable timing and increased system reliability. The BGA package provides enhanced thermal performance compared to traditional packages, enabling operation at higher temperatures. Refer to the Cypress datasheet for complete electrical characteristics, timing diagrams, and package dimensions.

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