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AWT6241RM27P9

Part No AWT6241RM27P9
Manufacturer Anadigics, Inc
Catalog END - OF - LIFE
Description HELP3TM UMTS/TD-SCDMA Linear Power Amplifier Module
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Manufacturer ANADIGICS, Inc
Win Source Part Number 1149993-AWT6241RM27P9
Manufacturer Homepage www.anadigics.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian AWT6241RM27P9 CAD Model

Description

The AWT6241RM27P9 is a power amplifier module designed for wireless applications. It was manufactured by Anadigics, Inc. While the product is listed as End-of-Life (EOL), it was primarily used in cellular handsets and data devices. This module is intended to amplify radio frequency (RF) signals, boosting their power for transmission.

Applications:

  • Cellular handsets (GSM/EDGE).
  • Data devices (e.g., USB modems).
  • Wireless modules.
  • RF Transmitters.
  • Mobile communication equipment.

Features:

  • High efficiency power amplification.
  • Integrated power control.
  • Compact module size.
  • Low voltage operation.
  • Internal matching circuitry.

Benefits:

  • Extends battery life in mobile devices through efficient power usage.
  • Provides consistent signal strength for reliable communication.
  • Simplifies RF design by integrating multiple functions into a single module.
  • Reduces board space requirements.
  • Offers stable performance across varying operating conditions.

Technical Specifications:

The AWT6241RM27P9 operates in the GSM/EDGE frequency bands. It supports a supply voltage range of 3.2V to 4.8V. The module provides a typical output power of +35dBm with a power-added efficiency (PAE) of around 50%. It includes an integrated power control feature to adjust the output power level dynamically, optimizing battery life. The device is typically packaged in a small surface-mount module, designed for automated assembly. The operating temperature range is from -30°C to +85°C. The input and output impedance are typically matched to 50 ohms.

The AWT6241RM27P9 was a key component in many older generation wireless devices, providing efficient and reliable RF power amplification. While no longer in production, understanding its specifications can be valuable for maintaining legacy systems or designing compatible replacement modules. The module's compact size and integrated features made it a popular choice for mobile devices where space and power efficiency were critical considerations. The internal matching circuitry simplified integration, reducing the need for external components and minimizing design complexity.

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