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Same model may have multiple batches, images only for reference.
1156LD/PBGA35x35mm AMKOR
Same model may have multiple batches, images only for reference.

1156LD/PBGA35x35mm

Part No 1156LD/PBGA35x35mm
Manufacturer AMKOR
Catalog HOT - SALES and EOL Components (0 - A)
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Manufacturer AMKOR
Win Source Part Number 148421-1156LD/PBGA35x35mm
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian 1156LD/PBGA35x35mm CAD Model

Description

The 1156LD/PBGA35x35mm is a cutting-edge package solution providing optimal thermal and electrical performance. It is specifically designed to meet the demands of high-density chip applications.

Features and Benefits

  • Optimal Thermal Management: Effectively dissipates heat in high-power applications.
  • Compact Footprint: Supports high-density layouts with minimal space requirements.
  • Reliable Connectivity: Ensures secure connections in demanding conditions.

Applications

  • Microprocessors and microcontrollers
  • Graphics processing units (GPUs)
  • FPGA-based systems

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