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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Number of I/O 328
Base Product Number XCZU9
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.31.0001
Standard Package 1
Win Source Part Number 1007503-XCZU9EG-1FFVB1156E
Ultra Librarian 3D Model Ultra Librarian XCZU9EG-1FFVB1156E CAD Model

Description

The XCZU9EG-1FFVB1156E is an electronic component used in embedded systems.

  • Series: Zynq UltraScale+ MPSoC EG
  • Core: Quad ARM Cortex-A53 MPCore with CoreSight, dual ARM Cortex-R5 with CoreSight, and ARM Mali-400 MP2
  • Speed: 500MHz, 600MHz, and 1.2GHz
  • Package: Tray
  • Standard Package: 1
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA and WDT
  • I/Os: 328
  • RAM Size: 256KB
  • Flash Size: None
  • Architecture: MCU, FPGA
  • Attributes: Zynq UltraScale+ FPGA, 599K+ logic cells
  • Package/Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
  • Temperature Range: 0°C to 100°C (TJ)
  • MSL: 4 (72 hours)
  • REACH: Unaffected
  • HTSUS: 8542.31.0001
  • Manufacturer: AMD Xilinx
  • Base Product Number: XCZU9

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $1,280.3031 $1,280.3031
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
Availability: 280 pieces
Order Increment : 1 piece
*Need More Quantity? *Request a Bulk Quantity Quotation?

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