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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EV
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU7
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1228808-XCZU7EV-1FBVB900E
Ultra Librarian 3D Model Ultra Librarian XCZU7EV-1FBVB900E CAD Model

Description

The AMD Xilinx XCZU7EV-1FBVB900E is an advanced Zynq® UltraScale+™ MPSoC EV series embedded system on chip (SoC) integrated circuit (IC) from AMD Xilinx.

  • Processor Core: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2
  • Processor Speed: 500MHz, 600MHz, and 1.2GHz
  • Package: Tray
  • Package/Case: 900-BBGA, FCBGA
  • RAM Size: 256KB
  • Logic Cells: 504K+
  • Temperature Range: 0°C to 100°C (TJ)
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals: DMA, WDT
  • Application: MCU, FPGA, and other embedded systems

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