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Same model may have multiple batches, images only for reference.
XCZU4EG-2FBVB900I Real Image
Same model may have multiple batches, images only for reference.

XCZU4EG-2FBVB900I

Part No XCZU4EG-2FBVB900I
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC SOC CORTEX-A53 900FCBGA  /  Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC series Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 533MHz, 600MHz, 1.3GHz 900-FCBGA (31x31)
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU4
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1011255-XCZU4EG-2FBVB900I
Ultra Librarian 3D Model Ultra Librarian XCZU4EG-2FBVB900I CAD Model

Description

The XCZU4EG-2FBVB900I from AMD Xilinx is an embedded system on chip (SoC) that is part of the Zynq® UltraScale+™ MPSoC EG series.

  • Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2
  • Speed: 533MHz, 600MHz, and 1.3GHz
  • Package: Tray
  • Standard Package: 1
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA and WDT
  • I/O: 204
  • RAM Size: 256KB
  • Flash Size: No flash
  • Architecture: MCU, FPGA
  • Primary Attribute: Zynq® UltraScale+™ FPGA, 192K+ Logic Cells
  • Package/Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
  • Temperature Range: -40°C ~ 100°C (TJ)
  • ECCN: 5A002A4 XIL
  • REACH Status: REACH unaffected
  • HTSUS Code: 8542.39.0001

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