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XCZU19EG-3FFVC1760E

Part No XCZU19EG-3FFVC1760E
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC SOC CORTEX-A53 1760FCBGA / Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC series Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 600MHz, 667MHz, 1.5GHz 1760-FCBGA (42.5x42.5)
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 667MHz, 1.5GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5x42.5)
Number of I/O 512
Base Product Number XCZU19
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1195716-XCZU19EG-3FFVC1760E
Ultra Librarian 3D Model Ultra Librarian XCZU19EG-3FFVC1760E CAD Model

Description

The XCZU19EG-3FFVC1760E is a Zynq UltraScale+ MPSoC EG integrated circuit designed for use in embedded system on chip (SoC) applications.

  • Processors: quad ARM Cortex-A53 MPCore with CoreSight and dual ARM Cortex-R5 with CoreSight processors, along with an ARM Mali-400 MP2 core processor
  • Speed: 600MHz, 667MHz, and 1.5GHz
  • Package: 1760-BBGA, FCBGA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripheral Features: DMA and WDT
  • I/Os: 512
  • RAM: 256KB
  • Architecture: MCU and FPGA
  • Primary Attribute: Zynq UltraScale+ FPGA, with 1143K+ logic cells.

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Availability: 430 pieces
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