XCZU19EG-1FFVB1517E Real Image
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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40)
Number of I/O 644
Base Product Number XCZU19
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1015394-XCZU19EG-1FFVB1517E
Ultra Librarian 3D Model Ultra Librarian XCZU19EG-1FFVB1517E CAD Model

Description

The XCZU19EG-1FFVB1517E is an embedded system on chip (SoC) manufactured by AMD Xilinx.

  • Series: Zynq UltraScale+ MPSoC EG series
  • Cores: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, and ARM Mali-400 MP2
  • Speed: 500MHz, 600MHz, and 1.2GHz
  • Packaging: Tray
  • Standard Package: 1
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA and WDT
  • I/O: 644
  • RAM Size: 256KB
  • MSL: Level 4 (72 hours)
  • REACH Status: REACH unaffected
  • Operating Temperature Range: 0°C to 100°C (TJ)
  • Architecture: MCU and FPGA
  • Primary Attributes: Zynq UltraScale+ FPGA and 1143K+ logic cells
  • Package/Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
  • ECCN: 5A002A4 XIL

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Availability: 9,800 pieces
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