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XCVU13P-L2FHGC2104E

Part No XCVU13P-L2FHGC2104E
Manufacturer Amd
Catalog OEM Souring
Description FPGA
Sample
Rohs State rohs
ECAD Module
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Category OEM Souring
Win Source Part Number 1463365-XCVU13P-L2FHGC2104E
Manufacturer Amd
Package Tray
Product Status Active
Number of LABs/CLBs 216000
Number of Logic Elements/Cells 3780000
Total RAM Bits 514867200
Number of I/O 416
Voltage - Supply 0.698V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 110°C (TJ)
Grade -
Package / Case 2104-BBGA, FCBGA
Supplier Device Package 2104-FCBGA (52.5x52.5)
Ultra Librarian 3D Model Ultra Librarian XCVU13P-L2FHGC2104E CAD Model

Description

As part of AMD/Xilinx's UltraScale+ product family, the XCVU13P-L2FHGC2104E FPGA is engineered to meet the demanding requirements of high-end data processing applications. This device encapsulates the advancements in FPGA technology, offering unparalleled performance, flexibility, and efficiency. It is particularly well-suited for use in data centers, machine learning, and high-performance computing tasks, where its capability to perform complex calculations and data manipulations at high speeds is invaluable. The XCVU13P-L2FHGC2104E features a substantial number of logic cells, high-speed transceivers, and a sophisticated clock management system, supporting the development of highly sophisticated and performance-intensive digital circuits. Its integration capabilities are further enhanced by a large number of I/O options and the support for various memory interfaces, ensuring versatility across different design needs. AMD/Xilinx's commitment to providing a robust ecosystem around the UltraScale+ series, including the Vivado Design Suite, further assists designers in leveraging the full potential of this FPGA, simplifying the design process and shortening the time to market for complex digital products.

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