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Same model may have multiple batches, images only for reference.
XCVU13P-2FHGA2104E
Same model may have multiple batches, images only for reference.

XCVU13P-2FHGA2104E

Part No XCVU13P-2FHGA2104E
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 832 I/O 2104FCBGA  /  series Field Programmable Gate Array (FPGA) IC 832 514867200 3780000 2104-BBGA, FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr AMD Xilinx
Series Virtex® UltraScale+™
Package Tray
Number of LABs/CLBs 216000
Number of Logic Elements/Cells 3780000
Total RAM Bits 514867200
Number of I/O 832
Voltage - Supply 0.825V ~ 0.876V
Mounting SMD (SMT)
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 2104-BBGA, FCBGA
Supplier Device Package 2104-FCBGA (52.5x52.5)
Base Product Number XCVU13
MSL Level 4 (72 Hours)
ECCN 3A001A7B
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1016307-XCVU13P-2FHGA2104E
Ultra Librarian 3D Model Ultra Librarian XCVU13P-2FHGA2104E CAD Model

Description

The XCVU13P-2FHGA2104E is a Virtex UltraScale+ Field Programmable Gate Array (FPGA) integrated circuit that offers 216000 LABs/CLBs and 3780000 logic elements/cells.

  • LABs/CLBs: 216000
  • Logic Elements/Cells: 3780000
  • Total RAM Capacity: 514867200 bits
  • Voltage Supply: 0.825V to 0.876V
  • Package/Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (52.5x52.5)
  • Operating Temperature: 0°C to 100°C (TJ)
  • ECCN: 3A001A7B
  • Ideal for: embedded systems, data center applications, and high-performance computing

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